In the age of smart phone is king, how to make them thinner and smaller at the same time, "brain" is also smart enough to have more functions. This is the expectation of many people, and is also a bottleneck in the progress of related technology.
Now, this problem has been gradually conquered in the hands of Professor Zhang Huaiwu of the University of Electronic Science and technology. Over the years, Zhang Huaiwu has been leading the team in the research of "printed electronics" project to overcome the bottleneck problem of electronic information products including smart phones.
Now, China has become the third country to master the core technology of "high-density interconnect hybrid integrated printed circuit" and "printed composite electronic materials and integrated embedded devices" after the US and Japan. In the process, China's high-end four generation printed electronics industry has grown from scratch to strength, and has made China's "intelligent manufacturing" occupy a considerable proportion of the international market share.
Scientific problems need to be solved
Where there is electronic information, there must be printed circuit board. China is a big country in printed circuit production. However, most of the printed circuit products in China have no intellectual property, low technical content and many simple processing products. "Advanced products with high technical content and high added value are monopolized by foreign printed circuit manufacturers." Zhang Huaiwu said.
The modern electronic equipment is highly integrated, miniaturized, portable and multifunctional, and requires printed circuit boards to develop towards the fourth generation of boards with high density, high reliability, high thermal conductivity and electromagnetic interference. With the intelligent mobile phone as an example, to make the body more petite, "a" more agile, "brain" smarter, you need to construct it in a more sophisticated. Zhang Huaiwu said that printing electronics is the key to solving this problem, and is also the most advanced technology in the world.
From the "printed circuit" to "printed electronics" is a scientific issue across the milepost of international, and the fourth generation of high density integrated printed circuit is printed on behalf of the modern electronics, it presents severe challenge to integration, embedded devices, heat conduction and heat radiation and other related materials and technology.
However, the key technology for the United States and Japan has long been monopolized by Chinese related industries because of technological backwardness and heteronomy.
Breaking the foreign technical blockade for ten years
The Zhang Huaiwu team is based on the National Key Laboratory of electronic thin films and integrated devices, and has long been committed to the fourth generation of high-density integrated printed circuit technology research.
After the project of high density interconnected integrated printed circuit technology, Zhang Huaiwu is responsible for the overall planning and design of the project. Based on the experiments again and again, he led the team in the world first developed composite materials, the thin film magnetic circuit, closed circuit model, realized with magnetic core inductance, antenna, EMI devices and capacitors, the resistance of the printing surface plating, thoroughly solves the technical index of four generation circuit board unit area increase line, device density.
What is another member of the team's players. He broke through the technical bottleneck of PCB any layer interconnection with colleagues, and for the first time in the world to establish the fine line production model of the fluid mechanics theory, to achieve the highest level in the world the American IPC Association announced the line / line distance, solve the problem of high density printed circuit wiring.
This series of innovative results indicates that China has mastered the core technology of high density interconnected hybrid integrated printed circuit, and even surpassed the highest level of Japan and the United States on many indicators.
"We have been doing this for ten years." Zhang Huaiwu said that the team started from the most basic theory of printed electronics, high thermal conductivity and organic materials, and gradually penetrated into components, circuits, heat dissipation, heat conduction, electromagnetic interference, packaging system and so on. Step by step, it finally stepped out of a road of independent innovation.
Boosting domestic industrial upgrading
Zhang Huaiwu and others have a series of independent intellectual property rights, which laid a solid foundation for the realization of the industrialization of printed electronics. But they did not wait for all the conditions to meet the market, but in the process of development and strategic cooperation with the related enterprises.
In early 2002, the team will take the initiative to the industrial front forward to Guangdong, zero distance to carry out school enterprise cooperation, technology accumulation and enterprise "the real thing" production combined successively with Zhuhai founder, Zhuhai Yuan Sheng and other enterprises, thus beginning the high density interconnection Chinese hybrid integrated circuit technology prelude "industrialization.
The cooperation with Zhuhai Fang is quite representative. From the line width of more than 100 microns to the current 25 micron line width, the two sides have built the first high-tech and best equipped high-density interconnected hybrid integrated printed circuit production platform in China, which is completely comparable with those in the US and Japan. From January 2011 to December 2013, Zhuhai founder made a series of printed circuit board products, and the total output value increased by 3 billion 200 million yuan, resulting in good economic and social benefits.
"We must establish R & D platform at all levels in order to achieve sustainable development." after reviewing the experience of industry university research cooperation, what is it for sighs, "in order to achieve win-win in cooperation, we must learn from closed doors, but not conducive to sustainable development of projects.
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